5-    Reactive Ion Etching-RIE (PE-100-RIE Benchtop Plasma Etching System)

     •    6” x 6” Water-Cooled RIE Electrode for “High-Rate” Anisotropic Etching 

     •    Automatic N₂ Purging Vacuum Pump.  Controlled Rate N₂ Chamber Vent

     •    Two MKS 0-50 SCCM Mass Flow Controllers, Two Gas Channels

     •    Thermocouple Vacuum Gauge, 0-1 Torr

     •    PC Based Control System with fully automatic system operation, process sequencing and multiple recipe storage

     •    Digital  Instrumentation

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