4-    Mask Aligner (UV-Lithography)

This SUSS MicroTec MJB4 system provides:

     •    Fast and highly accurate alignment
     •    HR Optics enables high resolution prints down to 0.5 μm
     •    Wafer and substrate handling up to 100 mm
     •    Can be upgradable with a UV-Nanoimprint Lithography toolkit

The system is capable of handling several exposure sequences:

Soft Contact:
The wafer is brought into contact with the mask and is fixed onto the chuck with vacuum. In this exposure mode the
MJB4 can achieve a resolution of 2.0 μm.
Hard Contact:
In hard contact mode the wafer is brought in direct contact with the mask, while positive nitrogen pressure is used to press the substrate against the mask. In hard contact mode a resolution in the 1 micron range is possible.
Vacuum Contact for High Precision:
In this mode, a vacuum is drawn between mask and substrate during exposure. This results in a high resolution of < 0.8 µ m.

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