ANALYSIS OF MEMS CANTILEVERS SENSOR WITH HALF CUT
STRESS CONCENTRATION (HCSC) HOLES DESIGN

S.M.Firdaus¹, Ishak Abd. Azid¹, O. Sidek², K. Ibrahim³, Magdy Hussien³

¹ School of Mechanical Engineering,

Engineering Campus, Universiti Sains Malaysia,

14300 Nibong Tebal, Penang, Malaysia

² Collaborative µElectronic Design Excellence Centre (CEDEC)

School of Electric and Electronic

Engineering Campus, Universiti Sains Malaysia,

14300 Nibong Tebal, Penang, Malaysia

³Nano-Optoelectronics Research and Technology (NOR) Lab

School of Physic

Universiti Sains Malaysia,

11800 Minden, Penang, Malaysia

This paper describes the design, fabrication and analysis of MEMS cantilever.   To understand the physical nature of this cantilever, an analysis has been completed successfully using Finite Element Analysis (FEA).   In order to increase the sensitivity of this cantilever sensor based on loading/force effect, holes in this cantilever is introduced. Theoretically stress concentration holes will increase the sensitivity and also the piezoresistive circuit output due to the increasing stress and displacement of the cantilever effect to the loading/force applied. The designs were simulated using ANSYS 9.0 in order to study the stress distribution and displacement effect, and then this MEMS cantilever has also been successfully fabricated.  The comparisons between solid cantilever and cantilever with holes are made. As expected the stress highly concentrated at the holes and increase the sensitivity by 1.5 times. The design can obviously result in an improvement on the sensitivity of the surface mode cantilever.

Keywords : MEMS , Cantilever, Fabrication, Sensitivity, ANSYS

Areas :Nanobiotech   

Corresponding Author:

Ishak Abdul Azid

School of Mechanical Engineering,

Engineering Campus, Universiti Sains Malaysia,

14300 Nibong Tebal, Penang, Malaysia

Tel: 6-04-5995999 ext 6304/6313  Fax:6-04-5941025

Email (ishak@eng.usm.my )